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IMD-M09F

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FEATURES

①Integrated Matrix Device (IMD) solution, pixel pitch 0.9375, flip chip design and energy saving.

②Integrated Matrix Device (IMD) solution, 8 pins design, solve the problems of soldering strength and crash.

③Black matt finish encapsulation, no specular reflection, higher brightness and contrast.

④Better and stronger reliability for weather.

⑤Achieve to the seamless combination, no modular color difference in whole screen, 100% tested and binning, better color consistency.

PRODUCT PARAMETERS

Product Name	Color	IF(mA) TEST	λd(nm) Typ	Iv(mcd) Typ	Vf(V) Typ	View angle (deg.)
IMD-M09F 1.6×1.6×0.67		5	620	40	1.9	120
		2	535	40	2.5	120
		2	464	8	2.6	120

DIMENSIONS/UNIT(mm)

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